Dimensionally Stable

EP112 Product Information

Two part, heat curing epoxy for potting, encapsulation, coating, sealing and impregnation

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EP112AO Product Description

Two Component, Low Viscosity Heat Curing Epoxy Resin System High PerformanceThermal Conductive & Electrical Insulation For Potting & Encapsulation Applications

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EP112FLAN-1 Product Information

High performance, two component, heat curing epoxy for potting & encapsulation

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EP112FLAO-1 Product Information

Toughened, two component, heat curing epoxy for potting & encapsulation

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Two Component, Medium Viscosity Heat Curing Cycloaliphatic Epoxy Resin System Optimized For High Performance Electrical And Electronic Applications In Outdoor/ Indoor Environments With Outstanding Arc, Corona and Tracking Resistance

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EP113 Product Information

Two Component Nanosilica Reinforced Epoxy Resin System Featuring Outstanding Mechanical Properties, Excellent Electrical Insulation, Superior Abrasion Resistance & Hardness as well as Optical Clarity for Coating, Casting, Potting, Encapsulation & Sealing for Services from -100°F to 500°F!