Dimensionally Stable

EP3UF Product Information

EP3UF One Part Epoxy Adhesive System

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

Supreme 45HTQ-4 Product Information

Supreme 45HTQ Two Component Epoxy

Two component epoxy system for bonding, sealing and casting

Supreme 34CA Product Information

Supreme 34CA Two Component Epoxy

Two Component Epoxy Resin System for High Pertormance Applications

EP29LPAO Product Information

EP29LPAO Two Part Epoxy System

Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.

EP30-2LB Product Information

EP30-2LB Two Part Epoxy System

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity. Meets NASA Low Outgassing Specifications.

EP21NDCL Product Information

EP21NDCL Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

EP41S-5 Product Information

EP41S-5 Two Part Epoxy System

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.

Supreme 3HTND-2CCM Product Information

Supreme 3HTND-2CCM One Part Epoxy

One Component, High Performance Epoxy System Featuring Fast Curing. Ideal for Glob Top Applications as well as Bonding and Sealing; Formulated to Withstand Thermal Cycling and Shock.

EP30-1LP Product Information

EP30-1LP Two Part Epoxy System

Two component epoxy system for high performance bonding, coating, sealing and casting

EP21AOND Product Information

EP21AOND Two Part Epoxy System

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulating Featuring a Convenient and Forgiving 1:1 Mix Ratio.

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