Low Outgassing

EP121AO Product Information

EP121AO Two Part Epoxy

Two component epoxy for potting, encapsulation, coating and sealing applications

EP125 Product Information

EP125 Two Component Epoxy

Two Component Toughened Epoxy Resin System for Prolonged Service above 500°F with Outstanding Chemical Resistance.

EP21ND-LO Product Information

EP21ND-LO Two Part Non-Drip Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Application Feature. Meets NASA Low Outgassing Specifications.

EP21TCHT-1 Product Information

EP21TCHT-1 Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.

EP21TDC-2LO Product Information

EP21TDC-2LO Two Part Epoxy

Two Component, Highly Flexiblized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation. Passes NASA Low Outgassing Test.

EP21TDCHT-LO Product Information

EP21TDCHT-LO Two Component Epoxy Adhesive

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP21TDCS-LO Product Information

EP21TDCS-LO Two Part Adhesive System

Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Passes ASTM 595 for NASA Low Outgassing

EP21TDCSMed Product Information

EP21TDCSMed Two Part Medical Grade Epoxy

High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications

EP29LPSP Product Information

EP29LPSP Two Part Epoxy

Two Component, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing and Coating Formulated for Service at Cryogenic Temperatures and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Requirements. Optically Clear.

EP29LPSPAO-1 Black Product Information

EP29LPSPAO-1 Black Two Part Epoxy

Two Component, Thermally Conductive, Electrically Insulating, Low Viscosity, Modified Heat Cured Epoxy System for Bonding, Sealing, Coating, Potting and Encapsulation. Cryogenically Serviceable and Capable of Withstanding Cryogenic Shock. Meets NASA Low Outgassing Specifications.

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