One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Meets NASA Low Outgassing Specifications.
One Component, Toughened Epoxy Adhesive/Sealant Offers Highly Desirable Combination of Properties Including High Peel and Shear Strengths, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Features Good Flow Properties. NASA low outgassing approved.
Flexibilized, One Component Epoxy Adhesive/Sealant Featuring Outstanding Shear and Peel Strength; Serviceable from 4°K to 350°F. Requires Minimum Cure Temperature of 250°F.
Two Component, Heat Resistant Epoxy Adhesive for High Performance General Purpose Bonding, Outstanding High Thermal Conductivity, Excellent Dimensional Stability Up to 250°F Service Featuring Both High Shear and High Peel Strength
Two Component, Room Temperature Curing, High Temperature Resistant Epoxy For Bonding & Sealing Featuring Outstanding Thermal Conductivity & Electrical Insulation Properties
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -112°F to +400°F Featuring High Peel and High Shear Strength
