Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Component, Room Temperature Curing, Passes ISO 10993-5. Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
One Component, Low Viscosity UV Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation, Featuring Excellent Physical Strength Properties and Low Shrinkage Upon Cure.
Low Viscosity, One Component, UV Curable Epoxy Based System for High Performance Bonding, Coating and Sealing with Exceptional Thermal Stability and Very Low Shrinkage upon Cure.
Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation
One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing and Encapsulating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg
One Component, Room Temperature Curing, Silicone Elastomer Adhesive for High Performance Bonding and Sealing; Featuring Flame Retardancy, and Very Fast Cure; Non-Corrosive.
