Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity.
Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Passes ASTM 595 for NASA Low Outgassing
Two Component Silver Conductive Epoxy for High Performance Bonding and Sealing Featuring Convenient Handling, Exceptional Low Volume Resistivity and High Flexibility.
High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications
Two Component, Nickel Modified Room Temperature Curing Polymer System Featuring High Electrical Conductivity, Superior Bonding Strength and Chemical Resistance For EMI/RFI Shielding As Well As Bonding, Sealing and Encapsulation Applications.
One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.
One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed
