Epoxy

EP21HV Product Description

EP21HV Two Part Epoxy

Two Component Epoxy Adhesive For High Performance Bonding, Sealing and Encapsulation

EP21LP Product Description

EP21LP Two Part Epoxy

Two Component Clear, Long Pot Life Epoxy Adhesive for High Performance General Purpose Bonding

EP21LV Product Information

EP21LV Two Component Low Viscosity Epoxy System

Versatile Two Component, Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating, Encapsulation and Casting.

Conforms to FDA Chapter 1, Section 175.105 for Indirect Food Applications.

EP21LV3/5Med Product Information

EP21LV3/5Med Two Part Epoxy Compound

Flexible, Two Component, Low Viscosity Epoxy System for High Performance Bonding, Sealing, Coating, Encapsulation & Casting. Conforms Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications. Meets USP Class VI Specifications for Medical Applications.

EP21ND Product Information

EP21ND Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

EP21ND-2 Product Information

EP21ND-2 Two Part Epoxy

Two Component Non-Drip Epoxy for High Performance General Purpose Bonding, Sealing, and Coating

EP21ND-LO Product Information

EP21ND-LO Two Part Non-Drip Epoxy

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Application Feature. Meets NASA Low Outgassing Specifications.

EP21Q Product Description

EP21Q Two Part Epoxy

Two Component Quartz Filled Epoxy System For High Performance Bonding, Coating and Sealing with Enhanced Corrosion And Abrasion Resistance

EP21SL5 Product Description

EP21SL5 Two Part Epoxy

Two Component, High Performance Epoxy Resin System For Bonding Teak And Other Wood Products

EP21TCHT-1 Product Information

EP21TCHT-1 Two Part Epoxy Adhesive

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.

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