Room Temperature Cure

EP30NS Product Information

EP30NS Two Part Epoxy

Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.

MasterSil 151TC Product Information

MasterSil 151TC Two Part Silicone

Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.

EP42HT-3AO Product Information

EP42HT-3AO Two Part Epoxy

Two Component, Thermally Conductive Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System with Excellent Chemical Resistance and Electrical Insulation Properties. Ideal for Potting & Encapsulation Applications.

EP30LTE-2 Product Information

EP30LTE-2 Two Part Epoxy

Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion, Excellent Dimensional Stability and Low Shrinkage Upon Cure.

EP21ND-LP Product Information

EP21ND-LP Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

MasterSil 170 Gel Product Information

MasterSil 170 Gel: Two part silicone encapsulant

Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System.

Supreme 3ANLV-1 Product Information

Supreme 3ANLV-1 One Part Epoxy

One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity

Supreme 11AOHTLP Product Information

Supreme 11AOHTLP Two Part Epoxy

Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.

X18Med Product Information

X18Med One Component Primer/Adhesive

High Performance Elastomer Based One-Component Adhesive for Fast Durable Bonding and Sealing of Polyolefins without Surface Pretreatment.

EP30DPSP Product Information

EP30DPSP Two Part Epoxy

Meets USP Class VI Specifications for Medical Applications Flexibilized, Two Component , Epoxy-Urethane Blend Used For Bonding, Coating, Sealing and Encapsulation, Featuring Superior Toughness, Repairability, Abrasion Resistance, and Cryogenic Serviceability

Seiten