Two Component, Room Temperature Curing, Toughened Epoxy Adhesive/Sealant for High Temperature Bonding Applications Up To 425°F. Features Convenient Handling
Two Component, Room Temperature Curing, Toughened Epoxy Adhesive/Sealant for High Temperature Bonding and Sealing. Offers High Shear and Peel Strength, Along With Convenient Handling.
One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
One Component, Heat Curing Epoxy Adhesive, Sealant Featuring Both High Shear and High Peel Strength for Optimal Bonding Performance and Exceptionally High Thermal Conductivity
Two Component Fast Curing Heat Resistant Toughened Epoxy Adhesive Featuring High Shear Strength, Superior Dimensional Stability, Good Chemical Resistance, Excellent Impact and Shock Resistance for Superior Bonding
One Component, UV Curable System for High Performance Coating, Bonding and Sealing, Featuring Excellent Physical Properties and Dimensional Stability; Exceptionally Low Viscosity; Ideal for Applications Involving Spin Coating.
