Two Component, Room Temperature Curing Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulation Featuring High Temperature Resistance, Good Dimensional Stability and Excellent Chemical Resistance.
Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Meets NASA Low Outgassing Specification ASTM E595.
Two Component, Lower Viscosity, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation with Outstanding Physical Properties and Easy Processing. Qualified to NASA Low Outgassing Specifications.
Two Component, Room Temperature Curing, Low Viscosity Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offering Superior Chemical Resistance and Excellent Physical Strength Properties.
Two Component, Room Temperature Curing Epoxy Compound for High Performance Bonding, Sealing, Casting and Potting Offers Outstanding Chemical Resistance along with Superior Physical Strength Properties.
Two Component Epoxy Resin System for Bonding, Coating and Sealing, Formulated for Outstanding Abrasion Resistance; Features High Shore D Hardness and Convenient One to One Mix Ratio.
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing; Featuring Paste Consistency, Non-Corrosive Cure and Serviceability Up to 300°C; Unsurpassed Stability at Elevated Temperatures
One Component, Room Temperature Curing Silicone Elastomer Adhesive for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.Meets MIL-A-46146 Type 2.
