Heat Cure

EP4TC-80 Product Description

EP4TC-80 One Part Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength.

Supreme 3DM-85 Product Information

Supreme 3DM-85 One Component Epoxy

One Component, Toughened Epoxy System Cures at 185°F.

Supreme 45HT-3 Product Information

Master Bond Supreme 45HT-3 Epoxy System

Two component, quartz filled epoxy system for bonding, sealing and casting features high temperature resistance and withstands abrasion

MasterSil 153AO Product Information

MasterSil 153AO Two Part Silicone System

Two part silicone for high performance casting, potting & encapsulation and sealing

EP42HT-2ANLV Product Information

EP42HT-2ANLV Two Component Epoxy

Two Component, Thermally Conductive, Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System. Ideal for Potting and Encapsulation.

EP21DP12 Product Description

EP21DP12 Two Part Urethane Modified Epoxy

Low Viscosity, Two Component Epoxy For High Performance, Bonding, Sealing, and Potting Applications. Featuring Excellent Flexibility and Thermal Cycling Capabilities. Urethane modified epoxy, available in many colors. Available in cans or with a gun type dispensing systems

EP4UF-80 Product Description

EP4UF-80 One Component Epoxy

One component epoxy for bonding and underfill applications, minimum curing temperature 80°C

EP4EN-80 Product Description

EP4EN-80 One Component Epoxy

One component epoxy for bonding and small encapsulation applications, minimum curing temperature 80°C. Thermally conductive, electrically insulating.

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