Fast Cure

EP3FL Product Information

One Component, Thermal Shock and Heat Resistant, Flexibilized Epoxy System for Bonding, as well as for Potting and Encapsulations up to ¼ Inch Thick; Features Good Toughness and Fast Cures.

Read more about EP3FL Product Information

EP3HT Product Information

One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Shear Strength Properties.

Read more about EP3HT Product Information

EP3HTS Product Information

One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.

Read more about EP3HTS Product Information

EP3HTSMed Product Information

One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed

Read more about EP3HTSMed Product Information

One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.

Read more about EP3RR-1 Product Description

EP3RRLV Product Information

Read more about EP3RRLV Product Information

EP41S Product Information

Two Component Epoxy Resin System for Durable, High Performance,
High Strength Coatings, Liners and Sealants Featuring Chemical Resistance and Fast Cure.

Read more about EP41S Product Information

EP41SMed Product Information

Two Component Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating. Including Small Encapsulations, Pottings & Castings Featuring Fast Set-Up and Handling Time Meets USP Class VI and ISO 10993-5 Specifications for Medical Applications.