One Component, Toughened Epoxy Adhesive/Sealant Offers Highly Desirable Combination of Properties Including High Peel and Shear Strengths, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Features Good Flow Properties. NASA low outgassing approved.
Two Component, Room Temperature Curing, High Temperature Resistant Epoxy For Bonding & Sealing Featuring Outstanding Thermal Conductivity & Electrical Insulation Properties
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -112°F to +400°F Featuring High Peel and High Shear Strength
Two Component, Room Temperature Curing, High Temperature Resistant Epoxy Adhesive/Sealant for Service from -112°F to +400°F Featuring High Peel and High Shear Strength. Meets NASA Low Outgassing Specifications.
One Component, Fast Curing, Toughened Epoxy for Bonding, Sealing and Coating Featuring Excellent Thermal Conductivity and Very Good Electrical Insulation Properties. Can Withstand Rigorous Thermal Cycling.
Two Component, Toughened, Quartz Filled, Heat Resistant Epoxy Compound for High Performance Bonding, Sealing and Casting Widely Used in Downhole, Oil Processing and Other Petrochemical Applications.
Two Component Toughened Heat Resistant Epoxy Adhesive for High Performance Structural Bonding, Sealing and Coating. Featuring Serviceability up to 500°F. Superior Thermal Cycling Capabilities.
