Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion, Excellent Dimensional Stability and Low Shrinkage Upon Cure.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Very Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.
Two Component, Optically Clear, Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating, Encapsulation & Casting. Features Excellent Adhesion To Glass, Polycarbonates, And Acrylics.
Quartz Filled, Two Component Epoxy System for High Performance Bonding, Sealing, Coating & Casting, Featuring Exceptionally Low Shrinkage and High Dimensional Stability.
Two Component, Paste Consistency Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
One Component, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications. B-Stage Epoxy Is Available in 30 Gram Cookies.
