UV15RCL Product Information

Red colored UV curable epoxy system

Low Viscosity, One Component, UV Curable Epoxy Based System for High Performance Bonding, Coating and Sealing that turns from red to clear upon exposure to UV light. with Exceptional Thermal Stability and Very Low Shrinkage upon Cure.

EP30D-7SPHT Product Information

Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation

MasterSil 323S-LO Product Information

Master Bond MasterSil 323S-LO Silicone System

Two component, silver filled silicone with superb electrical conductivity along with good heat transfer properties.

UV10TK Product Information

One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing and Encapsulating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg

MasterSil 707FR-NV Product Information

MasterSil 707FR One Part Silicone System

One Component, Room Temperature Curing, Silicone Elastomer Adhesive for High Performance Bonding and Sealing; Featuring Flame Retardancy, and Very Fast Cure; Non-Corrosive.

UL Listed For 94V.1 and 94V.0.

UV23FLDC-80TK Product Information

One Part, Dual Curing Adhesive UV23FLDC-80TK

One component, moderate viscosity, dual curing, cationic type system. Good flexibility. Serviceable from -80°F to 300°F.

LED415DC90 Product Information

One Part Adhesive LED415DC90

One component, dual curing LED system with a specialty light penetration profile allowing for rapid fixturing and subsequent curing by heat

MB297FLNT Product Information

One Part Cyanoacrylate MB297FLNT

Low viscosity, rubber toughened cyanoacrylate meets ISO 10993-5 standard

EP62-1HTMed Black Product Information

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures and Sterilization Resistance, Passes 10993-5 for Cytotoxicity

EP4G-80 Product Description

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.

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